PCB and hybrid singulation

Panels are often the preferred manufacturing method in the semi-conductor industry. When producing PCBs and circuits on ceramic boards (DBC, DCB, LTCC, HTCC), the individual PCBs are depaneled after the assembly process.

Baumann is a specialist in the field of singulating ceramic PCBs. Baumann's break|box provides a standardised and partially patented solution for both methods – laser perforation at the top or the bottom.

Baumann offers customers two effective solutions in the field of conventional PCB depaneling. Firstly, the newly developed rout|box, which uses an end mill to depanel PCBs from the populated panel. In this case, the milling paths can be freely programmed. Secondly, the well-known de|box, which utilises the so-called "V-Cut procedure", i.e. a pair of opposing separating blades.

All the versions can be realised either as a stand-alone cell or be integrated as modules into Baumann robot cells.

Application examples

Singulating the ceramic substrate (bottom perforation)
Singulating the ceramic substrate (bottom perforation)
Singulating the ceramic substrate (top laser perforation)
Singulating the ceramic substrate (top laser perforation)
 
PCB depaneling using an end mill
PCB depaneling using an end mill
PCB depaneling using the so-called "V-Cut procedure"
PCB depaneling using the so-called "V-Cut procedure"
 

 
 
 
 
Baumann GmbH

Contact

Further information on depaneling solutions can be found at:

handling-assembly@
baumann-automation.com