Singulating ceramic substrates

Patented standard solutions for high-quality hybrid production

Circuit boards are usually produced in panels. Baumann provides innovative and partially patented solutions for laser scribed and scored panels and is a leading expert in handling and singulating various types of ceramic PCBs:

  • Direct Bonded Copper – DBC or DCB
  • Low Temperature Cofired Ceramics –LTCC
  • Double-Sided Hybrid - DSH
  • High Temperature Cofired Ceramics – HTCC

Baumann is a leading expert in handling and singulating panels. The panels are fed in, positioned by a robot and singulated without fixtures or mechanical stops. The partially patented breaking procedure ensures a considerable reduction in conchoidal fractures and guarantees high quality breaking edge geometries. Production quality can also be monitored visually.

  • Panel sizes: 4" x 4" up to 9" x 8"
  • Substrate thickness: 0.25 and 1 mm
  • Minimum size: 5 x 5 mm
  • Minimum distance from assembly to breaking edge: 0.2 to 0.5 mm

New types of panels in record time

The configuration of new types of panels is one of the highlights of the module. It takes just a few minutes to enter the corner data for a new panel and thus install it in the software library for a subsequent type change, without the need for a mechanical changeover. The break|box is a standard module for ceramic substrate singulation.