Wafer handling laser – 3rd generation
Loading and unloading of laser systems
Lasers are used for material processing in order to increase the
efficiency of the solar cells. The individual wafers are fed to the
laser at a high throughput rate, individually and with a high degree of
precision.
Baumann wafer handling laser ...
... automates the loading
and unloading process. The wafers are transported through the system on
single-lane or multi-lane conveyors.
Specially developed singulation and transport techniques guarantee stress-free wafer handling with minimum breakage rates.
Main characteristics:
- Throughput of up to 3600 w/h
- Breakage rate ≤ 0.1%
- Technical availability ≥ 98%