Wafer handling laser – 3rd generation

Loading and unloading of laser systems

Lasers are used for material processing in order to increase the efficiency of the solar cells. The individual wafers are fed to the laser at a high throughput rate, individually and with a high degree of precision.

Baumann wafer handling laser ...

... automates the loading and unloading process. The wafers are transported through the system on single-lane or multi-lane conveyors.

Specially developed singulation and transport techniques guarantee stress-free wafer handling with minimum breakage rates.

Wafer handling Laser

Main characteristics:

  • Throughput of up to 3600 w/h
  • Breakage rate ≤ 0.1%
  • Technical availability ≥ 98%

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